High-Speed Photonics Interconnects

Dramatic increases in processing power have rapidly scaled on-chip aggregate bandwidths into the Tb/s range. This necessitates a corresponding increase in the amount of data communicated between chips, so as not to limit overall system performance. To meet the increasing demand for interchip communication bandwidth, researchers are investigating the use of high-speed optical interconnect architectures. Unlike their electrical counterparts, optical interconnects offer high bandwidth and negligible frequency-dependent loss, making possible per-channel data rates of more than 10 Gb/s. High-Speed Photonics Interconnects explores some of the groundbreaking technologies and applications that are based on photonics interconnects. From the Evolution of High-Speed I/O Circuits to the Latest in Photonics Interconnects Packaging and Lasers Featuring contributions by experts from academia and industry, the book brings together in one volume cutting-edge research on various aspects of high-speed photonics interconnects. Contributors delve into a wide range of technologies, from the evolution of high-speed input/output (I/O) circuits to recent trends in photonics interconnects packaging. The book discusses the challenges associated with scaling I/O data rates and current design techniques. It also describes the major high-speed components, channel properties, and performance metrics. The book exposes readers to a myriad of applications enabled by photonics interconnects technology. Learn about Optical Interconnect Technologies Suitable for High-Density Integration with CMOS Chips This richly illustrated work details how optical interchip communication links have the potential to fully leverage increased data rates provided through complementary metal-oxide semiconductor (CMOS) technology scaling at suitable power-efficiency levels. Keeping the mathematics to a minimum, it gives engineers, researchers, graduate students, and entrepreneurs a comprehensive overview of the dynamic landscape of high-speed photonics interconnects.

Energy-Efficient Photonic Interconnects for Computing PlatformsOdile Liboiron-Ladouceur, Nicola Andriolli, Isabella Cerutti, Piero Castoldi, and Pier Giorgio RaponiLow-Loss, High-Performance Chip-to-Chip Electrical Connectivity Using Air-Clad Copper InterconnectsRohit Sharma, Rajarshi Saha, and Paul A. KohlSilicon Photonic Bragg GratingsXu Wang, Wei Shi, and Lukas ChrostwoskiLasers for Optical InterconnectsBrian KochVertical-Cavity Surface-Emitting Lasers for InterconnectsWerner H.E. HofmannHigh-Speed Photodiodes and Laser Power Converters for the Applications of Green Optical InterconnectJin-Wei ShiQuantum-Dot Nanophotonics for PhotodetectionLudan Huang and Lih Y. LinRolled-Up Semiconductor Tube Optical CavitiesPablo Bianucci, M. Hadi Tavakoli Dastjerdi, Mehrdad Djavid, and Zetian Mi

Lukas Chrostowski, Ph.D., is an associate professor in the Electrical and Computer Engineering Department at the University of British Columbia, Vancouver, Canada. With current research interests in silicon photonics, optoelectronics, high-speed vertical-cavity surface emitting lasers (VCSELs) design, fabrication and testing, optical communication systems and biophotonics, he has published more than 100 journal and conference publications. Dr. Chrostowski has been serving since 2008 as the codirector of the University of British Columbia AMPEL Nanofabrication Facility. He is the program director of the NSERC CREATE Silicon Electronic–Photonic Integrated Circuits (Si-EPIC) training program. Krzysztof (Kris) Iniewski, Ph.D., manages R&D at Redlen Technologies, Inc., a startup company in Vancouver, Canada. He is also a president of CMOS Emerging Technologies, an organization of high-tech events covering communications, microsystems, optoelectronics, and sensors. Dr. Iniewski has held numerous faculty and management positions at the University of Toronto, University of Alberta, SFU, and PMC-Sierra, Inc. He has published more than 100 research papers in international journals and conferences. He holds 18 international patents granted in the United States, Canada, France, Germany, and Japan. He is a frequent invited speaker, has consulted for multiple organizations internationally, and has written and edited several books.