Fan-Out Wafer-Level Packaging

TRAMA

This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood.  Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.

SOMMARIO

Patent Issues of Fan-out Wafer-Level Packaging.- Flip Chip Technology vs. FOWLP.- Fan-In Wafer-Level Packaging vs. FOWLP.- Embedded Chip Packaging.- FOWLP: Chip-First and Die Face-Down.- FOWLP: Chip-First and Die Face-Up.- FOWLP: Chip-Last or RDL-First.- FOWLP: PoP with FOWLP.- Fan-Out Panel-Level Packaging (FOPLP).- 3D Integration.- Heterogeneous Integration.

AUTORE

SPECIALIZED PROFESSIONAL COMPETENCEDesign, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. SMT, fan-out/fan-in WLP, TSV, 3D IC Integration, heterogeneous integration and SiP. Leadfree soldering, manufacturing, and solder joint reliability. Management of a R&D Laboratory and Company. BACKGROUND AND PROFESSIONAL EXPERIENCE Ph.D.  (Theoretical and Applied Mechanics), University of Illinois, Urbana, IL (1977) M.S.   (Engineering Physics), University of Wisconsin, Madison, WI (1974) M.S.   (Structural Mechanics), University of British Columbia, Vancouver, BC (1973) M.S.   (Management Science), Fairleigh Dickinson University, Teaneck, NJ (1981) B.S.   (Civil Engineering), National Taiwan University, Taipei, Taiwan (1970)   ASM PacificTechnology (Sr. Technical Advisor), Hong Kong, July 2014 - Present Industrial Technology Research Institute (ITRI Fellow), Taiwan, Jan 2010 – June 2014 Hong Kong University of Science & Technology (Visiting Professor), Jan 2009 – Jan 2010 Institute of Microelectronic, (Director, System Packaging Lab), Singapore, 2006 - Jan 2009 Agilent Technologies, Inc. (Sr. Interconnection Specialist), Santa Clara, CA, 2000-2006 Express Packaging Systems, Inc., (President), Palo Alto, CA, 1995-2000 Hewlett-Packard Labs/Company (Senior MTS/Individual Contributor), Palo Alto, CA, 1984-1995 Sandia National Laboratories (Member of Technical Staff), Albuquerque, NM, 1982-1983 Bechtel Power Corporation (Lead Engineer), San Francisco, CA, 1981-1982 Ebasco (Lead Engineer), New York, NY, 1978-1980 Exxon Production and Research Company (Research Engineer), Houston, TX, 1977-1978   Editorial Board of ASME Transactions, Journal of Electronic Packaging, 1989-1999 Editorial Board of IEEE Transactions on Components, Packaging, Manufacture Technology, 1990-1995 Editor-in-Chief, Circuit World, 1998-2000. Program Chair ('90) to General Chair ('92) of the IEEE/CPMT IEMTS Program Chair ('93) to General Chair ('95) of the IEEE/CPMT ECTC Publication Chair for IEEE/ECTC Symposium Organizer/Chair of the ASME Winter Annual Meeting, 1987-2002 ASME Distinguish Lecturer (2000-2003), IEEE/CPMT Distinguish Lecturer (1998-present)   ASME Worcester Reed Warner Medal (2015) IEEE Components Packaging and Manufacturing Technology Field Award (2013) IMAPS William Ashman Achievement Award (2013) Pan Wen Yuan Distinguished Research Award (2011) IEEE/CPMT Outstanding Sustained Technical Contribution Award (2010) Best IEEE Transactions Paper Award (2010 Components Packaging and Manufacturing Technology) Outstanding Paper Award (2009 IEEE EPTC) SME Total Excellence in Electronics Manufacturing Award (2001) Best ASME Transactions Paper Award (2000 Journal of Electronic Packaging) IEEE/CPMT Outstanding Contribution Awards (2000) IEEE Meritorious Achievement Award in Continuing Education (2000)    ASME/EEP Technical Achievement Award (1998) IEEE/CPMT Manufacturing Awards (1994) Best of Conference Paper Award (1989 IEEE ECTC) IEEE Fellow (since 1994), ASME Fellow (since 1999), IMAPS Fellow (since 2013) Over 20 books, 450 peer-reviewed papers, 30 issued and pending patents, and 290 keynotes/lectures.

ALTRE INFORMAZIONI

• Condizione: Nuovo
• ISBN: 9789811088834
• Dimensioni: 235 x 155 mm
• Formato: Copertina rigida
• Illustration Notes: XX, 303 p. 278 illus., 226 illus. in color.
• Pagine Arabe: 303
• Pagine Romane: xx