Fan-Out Wafer-Level Packaging - Lau John H. | Libro Springer 04/2018 -

home libri books ebook dvd e film top ten sconti 0 Carrello

Torna Indietro

lau john h. - fan-out wafer-level packaging

Fan-Out Wafer-Level Packaging

Disponibilità: Normalmente disponibile in 15 giorni

129,98 €
123,48 €

Questo prodotto usufruisce delle SPEDIZIONI GRATIS
selezionando l'opzione Corriere Veloce in fase di ordine.

Pagabile anche con 18App Bonus Cultura e Carta del Docente

Facebook Twitter Aggiungi commento

Spese Gratis


Lingua: Inglese


Pubblicazione: 04/2018
Edizione: 1st ed. 2018


This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. 

Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.


Patent Issues of Fan-out Wafer-Level Packaging.- Flip Chip Technology vs. FOWLP.- Fan-In Wafer-Level Packaging vs. FOWLP.- Embedded Chip Packaging.- FOWLP: Chip-First and Die Face-Down.- FOWLP: Chip-First and Die Face-Up.- FOWLP: Chip-Last or RDL-First.- FOWLP: PoP with FOWLP.- Fan-Out Panel-Level Packaging (FOPLP).- 3D Integration.- Heterogeneous Integration.



Design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. SMT, fan-out/fan-in WLP, TSV, 3D IC Integration, heterogeneous integration and SiP. Leadfree soldering, manufacturing, and solder joint reliability. Management of a R&D Laboratory and Company.


Ph.D.  (Theoretical and Applied Mechanics), University of Illinois, Urbana, IL (1977)

M.S.   (Engineering Physics), University of Wisconsin, Madison, WI (1974)

M.S.   (Structural Mechanics), University of British Columbia, Vancouver, BC (1973)

M.S.   (Management Science), Fairleigh Dickinson University, Teaneck, NJ (1981)

B.S.   (Civil Engineering), National Taiwan University, Taipei, Taiwan (1970)


ASM Pacific Technology (Sr. Technical Advisor), Hong Kong, July 2014 - Present

Industrial Technology Research Institute (ITRI Fellow), Taiwan, Jan 2010 – June 2014

Hong Kong University of Science & Technology (Visiting Professor), Jan 2009 – Jan 2010

Institute of Microelectronic, (Director, System Packaging Lab), Singapore, 2006 - Jan 2009

Agilent Technologies, Inc. (Sr. Interconnection Specialist), Santa Clara, CA, 2000-2006

Express Packaging Systems, Inc., (President), Palo Alto, CA, 1995-2000

Hewlett-Packard Labs/Company (Senior MTS/Individual Contributor), Palo Alto, CA, 1984-1995

Sandia National Laboratories (Member of Technical Staff), Albuquerque, NM, 1982-1983

Bechtel Power Corporation (Lead Engineer), San Francisco, CA, 1981-1982

Ebasco (Lead Engineer), New York, NY, 1978-1980

Exxon Production and Research Company (Research Engineer), Houston, TX, 1977-1978


Editorial Board of ASME Transactions, Journal of Electronic Packaging, 1989-1999

Editorial Board of IEEE Transactions on Components, Packaging, Manufacture Technology, 1990-1995

Editor-in-Chief, Circuit World, 1998-2000.

Program Chair ('90) to General Chair ('92) of the IEEE/CPMT IEMTS

Program Chair ('93) to General Chair ('95) of the IEEE/CPMT ECTC

Publication Chair for IEEE/ECTC

Symposium Organizer/Chair of the ASME Winter Annual Meeting, 1987-2002

ASME Distinguish Lecturer (2000-2003), IEEE/CPMT Distinguish Lecturer (1998-present)


ASME Worcester Reed Warner Medal (2015)

IEEE Components Packaging and Manufacturing Technology Field Award (2013)

IMAPS William Ashman Achievement Award (2013)

Pan Wen Yuan Distinguished Research Award (2011)

IEEE/CPMT Outstanding Sustained Technical Contribution Award (2010)

Best IEEE Transactions Paper Award (2010 Components Packaging and Manufacturing Technology)

Outstanding Paper Award (2009 IEEE EPTC)

SME Total Excellence in Electronics Manufacturing Award (2001)

Best ASME Transactions Paper Award (2000 Journal of Electronic Packaging)

IEEE/CPMT Outstanding Contribution Awards (2000)

IEEE Meritorious Achievement Award in Continuing Education (2000)   

ASME/EEP Technical Achievement Award (1998)

IEEE/CPMT Manufacturing Awards (1994)

Best of Conference Paper Award (1989 IEEE ECTC)

IEEE Fellow (since 1994), ASME Fellow (since 1999), IMAPS Fellow (since 2013)

Over 20 books, 450 peer-reviewed papers, 30 issued and pending patents, and 290 keynotes/lectures.

i libri che interessano a chi ha i tuoi gusti

Altre Informazioni



Condizione: Nuovo
Dimensioni: 235 x 155 mm Ø 653 gr
Formato: Copertina rigida
Illustration Notes:52 Illustrations, black and white
Pagine Arabe: 303
Pagine Romane: xx

Utilizziamo i cookie di profilazione, anche di terze parti, per migliorare la navigazione, per fornire servizi e proporti pubblicità in linea con le tue preferenze. Se vuoi saperne di più o negare il consenso a tutti o ad alcuni cookie clicca qui. Chiudendo questo banner o proseguendo nella navigazione acconsenti all’uso dei cookie.