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jawitz martin w.; jawitz michael j. - materials for rigid and flexible printed wiring boards

Materials for Rigid and Flexible Printed Wiring Boards

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Dettagli

Genere:Libro
Lingua: Inglese
Editore:

CRC Press

Pubblicazione: 09/2006
Edizione: 1° edizione





Trama

Proper selection of materials is crucial to meet the end-use requirements of flexible and rigid printed wiring boards. While there are many books and articles on the fabrication of printed circuit boards, there is no single reference that details the properties of the materials used and how they are made. Materials for Rigid and Flexible Printed Wiring Boards presents important manufacturing information and material properties for reinforcement materials, resins, flexible films, copper foils, rigid laminates, high speed/high frequency laminates, and metal core and constraining core materials. It offers practical guidance to help designers, engineers, and fabricators choose suitable materials.




Note Editore

Complex electronic circuits and devices are flooding applications in nearly every facet of commercial and industrial activity, from automated equipment to all types of consumer products. Proper selection of materials is crucial to meet the end-use requirements of flexible and rigid printed wiring boards. While there are many useful books and articles on the fabrication of printed circuit boards, Materials for Rigid and Flexible Printed Wiring Boards is the first book to detail the properties of the materials used and how they are made.The authors present important manufacturing information and material properties for reinforcement materials, resins, flexible films, copper foils, rigid laminates, high-speed/high-frequency laminates, and metal core and constraining core materials. They offer practical guidance to help designers, engineers, and fabricators choose suitable materials to successfully meet strength, weight, thickness, performance, cost, and other requirements. In most cases, the material data comes directly from manufacturers' data sheets, representing typical values. The book illustrates the comparative strengths and limitations of the materials, highlights their basic properties, and details the manufacturing processes used to make them.Offering practical guidance based on years of experience, Materials for Rigid and Flexible Printed Wiring Boards is a one-stop source of crucial information for anyone designing or building printed circuit boards for any application.




Sommario

REINFORCEMENT MATERIALSReinforcement Materials-RigidGlassGlass CompositionGlass Fiber ManufacturingFrom Yarn to FabricGlass Types and ConstructionGlass Fabric WeaveSurfacing Mat, Paper or VeilGlass Fiber PaperQuartzProperties of Glass FabricsAramidsConstraining Dielectric Materials (Kevlar®)RESINSIntroductionPolyester ResinEpoxyPolyimideCyanate Ester and Cyanate Ester Blends (BT Resin)Polyphenylene Oxide (PPO) Epoxy BlendsPolytetrafluoroethylene Resin (PTFE)FLEXIBLE FILMSIntroductionTypes of Flexible MaterialsAdhesivesCover Coat/CoverlayBondpliesConductive MaterialsCopper Clad LaminatesCOPPER FOILSIntroductionElectrodeposited Copper FoilRolled Copper FoilsGradesNickel FoilLAMINATES, RIGIDIntroductionNEMA GradesComposite LaminatesRigid Laminates (Glass Reinforced)Laminates, Rigid Glass ReinforcedAramid LaminatesPrepregAdditive LaminatesHIGH-SPEED/HIGH-FREQUENCY LAMINATESIntroductionHigh-Speed/High-Frequency LaminatesThin LaminatesResinsHigh-Frequency Laminate DesignationsLaminate ConstructionBondingDimensional StabilityDrillingReferencesMETAL CORE AND CONSTRAINING CORE MATERIALSIntroductionCopper-Invar-Copper (CIC)Copper-Molybdenum-Copper (CMC)Silicon Carbide Reinforced Aluminum (SiC/Al)Coefficient of Thermal Expansion Trade-Offs (CTE)APPENDIXINDEX










Altre Informazioni

ISBN:

9780824724337

Condizione: Nuovo
Collana: Electrical and Computer Engineering
Dimensioni: 9 x 6 in Ø 0.85 lb
Formato: Copertina rigida
Illustration Notes:37 b/w images and 50 tables
Pagine Arabe: 192


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