Handbook of Lapping and Polishing

This is the first English language book to describe the most precise processes available for finishing the surfaces of mechanical as well as electronics and semiconductor components. The Handbook of Lapping and Polishing begins with an introduction focused on the fundamental concepts and the basics of lapping and polishing processes. The book builds on this foundation to discuss lapping of ductile and brittle materials, with a special chapter devoted to lapping equipment. Sections on polishing and chemical-mechanical polishing (CMP) round out the discussion. Experts from the US, Germany, and Japan present the latest technologies for lapping and polishing along with case studies.

Lapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the physical processes involved are closely guarded as proprietary information. The Handbook of Lapping and Polishing is the first source in English to bring to the light of day the physical fundamentals and advanced technologies at the leading edge of modern lapping and polishing practice.Collecting decisive work contributed by industrial and academic experts from the USA, Germany, and Japan, this authoritative resource presents the latest lapping and polishing technologies along with case studies that illustrate their value. After a brief introduction, the book explains the fundamental concepts and major types of lapping and polishing processes. The discussion then turns to lapping of ductile and brittle materials followed by an in-depth look at lapping machines and equipment. Rounding out the presentation, the final chapters discuss polishing technologies and equipment as well as the latest on chemical-mechanical polishing (CMP) and its applications in the semiconductor industry.Offering an integrated approach to both theory and practical applications under a single cover, the Handbook of Lapping and Polishing supplies a definitive survey of the most advanced surface finishing technologies available.

INTRODUCTION; Ioan MarinescuFrom Craft to ScienceImportance of the AbrasiveProblem SolvingReferencesFUNDAMENTALS OF LAPPING; Eckart UhlmannGeneral ConsiderationsHistorical Development of LappingDefinition of Lapping and Classification of Lapping ProcessesProcess Mechanisms and Subsurface Damage in LappingLapping Process as a Removal SystemTool SpecificationMachine SettingsFundamentals of Planetary KinematicsProcess Models and SimulationSymbols and AbbreviationsReferencesLAPPING OF DUCTILE MATERIALS; Ioan Marinescu, Ion Benea, and Naga Jyothi SankuIntroductionPhysics of the ProcessMechanism of the ProcessReferencesBibliographyLAPPING OF BRITTLE MATERIALS; Ioan Marinescu, Ion Benea, and Mariana PruteanuIntroductionBackground InformationNontraditional Lapping ProcessesELID-Lap GrindingMaterials, Experimental Setup, and Testing Procedure (Study Case)Experimental Results and DiscussionReferencesBibliographyAppendix AAppendix BLAPPING AND LAPPING MACHINES; Toshiro K. Doi and Daizo Ichikawa IntroductionProcessing Principles of Lapping and Its CharacteristicsLapping MachineBoth-Sides Simultaneous Lapping Machine Equipped with a New Micromotion MechanismConclusionsPOLISHING TECHNOLOGY; Toshiro K. DoiPolishing PrinciplesProcessing Accuracy and Damaged LayerPolishing MachinesMechanochemical Polishing and Chemical Mechanical PolishingNoncontact PolishingMagnetoabrasive FinishingPolishing Process Applying Electrophoretic DepositionElectroabrasive Mirror Polishing ProcessP-MAC PolishingColloidal Silica PolishingReferencesCHEMICAL MECHANICAL POLISHING AND ITS APPLICATIONS IN ULSI PROCESS; Toshiro K. DoiOrientations and Role of CMP in Semiconductor ProcessBasic Concept of Planarization CMPBasic Technology of Planarization CMPThe Study Case of Device WaferThin Film Magnetic Recording HeadsCMP of Compound Semiconductor WafersReferencesINDEX

Marinescu, Ioan D.; Uhlmann, Eckart; Doi, Toshiro