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libeskind-hadas ran; hasan nany; cong jingsheng jason; mckinley philip; liu c.l. - fault covering problems in reconfigurable vlsi systems
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Fault Covering Problems in Reconfigurable VLSI Systems

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Dettagli

Genere:Libro
Lingua: Inglese
Editore:

Springer US

Pubblicazione: 04/1992
Edizione: 1





Trama

Fault Covering Problems in Reconfigurable VLSI Systems describes the authors' recent research on reconfiguration problems for fault-tolerance in VLSI and WSI Systems. The book examines solutions to a number of reconfiguration problems.
Efficient algorithms are given for tractable covering problems and general techniques are given for dealing with a large number of intractable covering problems.
The book begins with an investigation of algorithms for the reconfiguration of large redundant memories. Next, a number of more general covering problems are considered and the complexity of these problems is analyzed. Finally, a general and uniform approach is proposed for solving a wide class of covering problems.
The results and techniques described here will be useful to researchers and students working in this area. As such, the book serves as an excellent reference and may be used as the text for an advanced course on the topic.




Sommario

1 An Overview.- 1.1 Introduction.- 1.2 The Embedding Approach.- 1.3 The Covering Approach.- 1.4 Overview of Remaining Chapters.- 2 Fault Covers in Rectangular Arrays.- 2.1 Introduction.- 2.2 Admissible Assignments.- 2.3 The Feasible Minimum Cover Problem.- 2.4 The Feasible Cover Problem.- 2.5 Two Reconfiguration Problems.- 2.6 Summary.- 3 Fault Covers in Heterogeneous and General Arrays.- 3.1 Introduction.- 3.2 Fault Covers in Heterogeneous Arrays.- 3.3 Fault Covers in General Arrays.- 3.4 Summary.- 4 General Formulation of Fault Covering Problems.- 4.1 Introduction.- 4.2 A General Formulation.- 4.3 Illustrative Examples.- 4.4 Integer Linear Programming Approach.- 4.5 Complexity Analysis of Subcases.- 4.6 Summary.










Altre Informazioni

ISBN:

9780792392316

Condizione: Nuovo
Collana: The Springer International Series in Engineering and Computer Science
Dimensioni: 235 x 155 mm
Formato: Copertina rigida
Illustration Notes:XIII, 130 p.
Pagine Arabe: 130
Pagine Romane: xiii


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