WIRE BONDING IN MICROELECTRONICS

TRAMA

The classic sourcebook for designing and evaluating wire bonds engineered with the latest metallurgies_completely updated. . Wire bonding is the attachment of fine wires from semiconductor chips to their substratesa connection that is vital to the success of ever-shrinking consumer electronic devices, such as iPODs. Long-established as the industry standard, this book has been completely revised and expanded to cover wire bonding advances for the era of super-small electronics.. . "Wire Bonding in Microelectronics, Second Edition," equips you with everything needed to design and evaluate wire bonds engineered with cutting-edge metallurgies. The Second Edition provides full details and step-by-step instructions for engineering reliable bonds at a very high yield. The author presents up-to-the-minute information on utilizing fine-pitch wire bonds, low-looping bonds, wafer-level bumping,

ALTRE INFORMAZIONI

• Condizione: Nuovo
• ISBN: 9780071476232
• Dimensioni: 9.50 x 6.50 x 1.25 inch.
• Formato: Hardcover
• Pagine Arabe: 426