When AIAA Meets IEEE

TRAMA

This book is about the cooperation of AIAA and IEEE, two major engineering organizations from two distinct focus points of technologies: intelligent aero-engine and electrified aviation. AIAA and IEEE both have their intrinsic needs for each other and their co-working is a must-have in the rest of 21st century. AIAA needs IEEE to become smarter and greener and IEEE needs a much broader scope to enlarge its marketplace and playground. The topics related to AIAA's and IEEE's co-project are highly multi- and inter-disciplinary related and highly goal-oriented. The target audience of this book is IEEE, AIAA members and other related professionals from universities, industries and institutes in the fields of AI-driven smart systems and electric airplanes with the associated new electric aero-engines and mobile aviation electric powers.The key contentsWhen AIAA is Meeting IEEE     AIAA vs. IEEE     How to interact and what to achieve     The mindset analysis of AIAA and IEEEThe smarter AIAA     The AI - Smart brain, IoT, e-devices     The smart sensors for AIAA -scenarios, fabrication, challenges, and testingsElectric aviation     Versatile, smarter, and green     The evolution of aero-engines - pistol, gas turbine, electric aero-engine     The integration of aero-engines and aero-craft     Delta VTOLer and STOL for B787     Rotatable wing and VTOL operationThe RDF jet – a new electric aero-engine     The features: small, light, thrust     The architecture: motor, fan, jet     The principle: rim driven, Tai Chi fan, duct, and jetAviation electric power grid    Energy and weight     Battery, LTG, and 3D HK SC

SOMMARIO

Chapter 1. AIAA and IEEE.- Chapter 2. 1st interaction -The Intelligent AIAA.- Chapter 3. 2nd interaction - The electrified aviation.

AUTORE

Franklin Li Duan got his B.E. and M.E. from the Institute of Microelectronics, Tsinghua University, China, in 1985 and 1987, respectively. In 1998, he got his Ph.D. from the School of Information and Technology Engineering, George Mason University in Virginia, USA. He has over 15 years' experience in Silicon Valley (LSI and AMD) in IC industry. He joined Shanghai Jiao Tong University, China, in 2013 in the School of Electronics Information and Electrical Engineering, focusing on the interactive work between IEEE and AIAA from the perspectives of high-temperature IoT sensors, advanced sensing and RF devices for intelligent aero-engine plans (wireless passive/embedded MEMS/high-temperature sensors and RF/remote system) and advanced electrified rim-driven magnetic motors together with the high-power and energy-density 3D HK supercapacitor. 

ALTRE INFORMAZIONI

• Condizione: Nuovo
• ISBN: 9789811983962
• Dimensioni: 235 x 155 mm
• Formato: Brossura
• Illustration Notes: XV, 381 p. 250 illus., 232 illus. in color.
• Pagine Arabe: 381
• Pagine Romane: xv