Green Electronics Manufacturing

NOTE EDITORE

Going "green" is becoming a major component of the mission for electronics manufacturers worldwide. While this goal seems simplistic, it poses daunting dilemmas. Yet, to compete effectively in the global economy, manufacturers must take the initiative to drive this crucial movement. Green Electronics Manufacturing: Creating Environmental Sensible Products provides you with a complete reference to design, develop, build, and install an electronic product with special consideration for the product’s environmental impacts during its whole life cycle. The author discusses how to integrate the state-of-the-art technologies of finite element method (FEM) modeling, simulation, and testing to create environmental sensible products of satisfying global environmental regulations, such as Restriction of Hazardous Substances (ROHS) compliance. He covers enabling techniques such as advanced fatigue life modeling, crack propagation analysis, and probabilistic robust design of lead-free electronics. The book also explores how risk engineering methodology empowers practitioners with effective tools such as buckling analysis of tin whiskers.With its emphasis on reducing parts, rationing materials, and reusing components to make products more efficient to build, green electronics intertwines today’s electronics with manufacturing strategies of global sourcing, concurrent engineering, and total quality. Implemented through product and process design, it can help you achieve sustainability to support future generations and at the same time preserve our natural resources. Green Electronics Manufacturing: Creating Environmental Sensible Products gives you the tools to create environmental sensible products while maintaining electronics quality and reliability.

SOMMARIO

Green Electronic Assembly: Strategic Industry Interconnection Direction Starting from Your Personal Electronic Lab: Review the Soldering Process Lead-Free Solder Tip Lead-Free Solder Bumps Flip-Chip Technology Flip-Chip Assembly Process Mechanical Stress and Electromigration Residual Mechanical Stress Mitigate Deterioration of Lead-Free Tin Solder at Low Temperatures Able to "Take the Heat?": Capability to Withstand High Temperature Solder Joint Fatigue Finite Element Analysis Bibliography Tin Whiskers: New Challenge for Long-Term RoHS Reliability Tin Whisker Growth in Lead-Free Electronics Variability with Tin Whisker Mechanisms Tin Whisker Risk: Lesson from the Nuclear Industry What Are Tin Whiskers? What Factors Influence Whisker Growth? Why Whiskers Are a Serious Reliability Risk to Electronic Assemblies How to Mitigate Tin Whisker Risk Use Finite Element Modeling to Assess Tin Whisker Risk How to Evaluate Tin Whisker Impact on High-Reliability Applications Bibliography Fatigue Characterization of Lead-Free Solders Surface-Mount TechnologyFatigue and Thermal Fatigue of Solder JointsFatigue, Microstructure, and Microstructural Aging Bibliography Lead-Free Electronic Reliability: Finite Element Modeling Finite Element Modeling and Inelastic Strain Energy Density FEM Model Description Inelastic Strain Energy Density Material Characterizaton of Underfill Materials Solder Joint Integrity in Accelerated Thermal Cycling Life Prediction and Field Life Correlation with ATC Life Bibliography Lead-Free Electronic Reliability: Fatigue Life Model Time-Independent Plasticity Model Fatigue Life Prediction Models Life Prediction Calculation Using Darveaux’s Energy-Based Model Solder Joint Integrity in Accelerated Thermal Cycling Effect of Tg of the Underfill Material Bibliography Lead-Free Electronic Reliability: Higher Temperature Computer Coupling of Phase Diagrams and Thermochemistry and Differential Thermal Analysis Solder Joint Integrity in Accelerated Thermal Cycling 0°C to 90°C Field Profiles Relative Damage Index Bibliography Fatigue Design of Lead-Free Electronics and Weibull Distribution Fatigue Design of Lead-Free Electronics Weibull Distribution for Life Testing Data Analysis Fatigue Life Prediction Based on Field Profile Copper Trace Integrity Fatigue Validation of Lead-Free Circuit Card Assembly Bibliography Enhancing Reliability of Ball Grid Array Thermally Enhanced BGA Typical TEBGA Package and Finite Element Modeling Finite-Volume-Weighted Averaging Technique 8.4 Parametric Design of TEBGA Reliability Bibliography Finite Element Modeling under High-Vibration and High-Temperature Environments Lead versus Lead-Free Solder Analytical Model: PCB Normal Modes and Displacement Finite Element Model: Random Vibration FEM Model Optimization under High-Vibration Environment FEM Model Validation under High-Temperature Environment Bibliography Probabilistic Modeling of the Elastic-Plastic Behavior of 63Sn-37Pb Solder Alloys Continuum Damage Mechanics Probabilistic Continuum Damage Mechanics Model Bibliography Flip-Chip Assembly for Lead-Free Electronics Flip-Chip Assembly Process Placement Stage Underfill Stage Finite Element Modeling of Die Stress Gold Stud Bump Bonding Impacts on the Process Materials and Process VariationsIntegrating Flip Chip into a Standard SMT Process Flow Bibliography Flip-Chip Bonding Technique for Lead-Free Electronics Lead-Free Reflow Soldering Techniques and Analytical Methods Electromigration Analysis for Mean-Time-to-Failure Calculations Electromigration Analysis Bibliography Flip-Chip Bonding of Opto-Electronic Integrated Circuits Gold–Tin Solder Integrating Vertical-Cavity Surface-Emitting Lasers onto Integrated Circuits Flip-Chip Bonding and Opto-Electronic Integration Case Study: A VCSEL Bonded to a Driver Chip Solders for Flip-Chip Bonding Design of Flip-Chip Bonding Structure Processing of Flip-Chip Bonding Structures Solders for Flip-Chip Bonding Bibliography Let’s Package a Lead-Free Electronic Design Select the Package Type: Flip-Chip Packaging Select Substrate or Die Attachment: FR4 Select Electrical Connections from Die to FR4 Assess Impact of CTE Mismatch on Stress and Fatigue Life Design Solder Balls for External Connection to PCB Thermal Analysis of Flip-Chip Packaging RLC for Flip-Chip Packages Drop Test of Flip-Chip Packaging Weibull Analysis of Life Test Data Bibliography Index

ALTRE INFORMAZIONI

• Condizione: Nuovo
• ISBN: 9781138074514
• Dimensioni: 9.25 x 6.25 in Ø 1.00 lb
• Formato: Brossura
• Illustration Notes: 97 b/w images, 37 tables and Approx. 86 equations
• Pagine Arabe: 360