Electronic Packaging Materials and Their Properties

TRAMA

This practical book examines packaging architecture, outlining the classification of materials and their uses for various tasks requiring performance over time. Topics include reliability, design, and cost; heat dissipation problems; and signal delay. TOC:Introduction.- Properties of Electronic Packaging Materials.- Zeroth-Level Packaging Materials.- First-Level Packaging Materials. Second-Level Packaging Materials.- Third-Level Packaging Materials.- Summary. Appendices. Index.

NOTE EDITORE

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation.Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:interconnectionsprinted circuit boardssubstratesencapsulantsdielectricsdie attach materialselectrical contactsthermal materialssoldersElectronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

SOMMARIO

IntroductionProperties of Electronics Packaging MaterialsElectrical PropertiesThermal and Thermomechanical PropertiesMechanical PropertiesChemical PropertiesMiscellaneous PropertiesZeroth-Level Packaging MaterialsSemiconductorsAttachment MaterialsSubstratesFirst-Level Packaging MaterialsWire InterconnectsTape InterconnectsCase MaterialsLid SealsLeadsSecond-Level Packaging MaterialsReinforcement Fiber MaterialsResinsLaminatesConstraining CoresFlexible Wiring Board MaterialsConductor Metals in LaminatesConformal CoatingsThird-Level Packaging MaterialsBackpanel MaterialsConnectors MaterialsCables and Flex Circuit MaterialsSummaryAppendicesIndex

AUTORE

Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan

ALTRE INFORMAZIONI

• Condizione: Nuovo
• ISBN: 9780849396250
• Collana: Electronic Packaging
• Dimensioni: 9.25 x 6.25 in Ø 0.88 lb
• Formato: Copertina rigida
• Illustration Notes: 61 tables
• Pagine Arabe: 128