High-Frequency Characterization Of Electronic Packaging - Martens Luc | Libro Springer 10/1998 - HOEPLI.it


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High-Frequency Characterization of Electronic Packaging




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Dettagli

Genere:Libro
Lingua: Inglese
Editore:

Springer

Pubblicazione: 10/1998
Edizione: 1998





Sommario

Preface. 1. Electronic Packaging and High Frequencies. 2. Electrical Description of Electronic Packaging. 3. High-Frequency Measurement Techniques. 4. High-Frequency Measurement Techniques for Electronic Packaging. 5. Measurement-Based Modeling Algorithms. Index.




Trama

High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems.
High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models.
High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples.







Altre Informazioni

ISBN:

9780792383079

Condizione: Nuovo
Collana: Electronic Packaging and Interconnects
Dimensioni: 235 x 155 mm Ø 940 gr
Formato: Copertina rigida
Pagine Arabe: 158
Pagine Romane: xii






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