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das nirod k. (curatore); bertoni henry l. (curatore) - directions for the next generation of mmic devices and systems

Directions for the Next Generation of MMIC Devices and Systems

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Dettagli

Genere:Libro
Lingua: Inglese
Editore:

Springer

Pubblicazione: 11/1997
Edizione: 1997





Sommario

Scanning the Conference.- Historical Perspectives on Microwave and Millimeter-Wave Integrated Circuits.- Mafet Thrust 3: A Revolutionary Program for Solid-State Microwave and Millimeter-Wave Power.- Future Directions in MMIC Research and Technology: The Wireless Pull.- Systems and Integration.- High Density Microwave Packaging Technology Development for Department of Defense Applications.- Flip Chip Power MMICS Packaging Technology.- Multilevel Vertical Interconnection Technology.- Multilevel Packaging for Low Cost Microwave Functions.- Future Applications of Millimeter Technology.- Distributed Power Combining and Signal Processing in a 2D Quasi-Optical System.- Multilayer Integration of Microwave and Millimeter-Wave Circuits: New Interconnect Methods and Design Considerations.- The Hybrid Integration Technique of Planar and NRD-Guide Circuits for Millimeter-Wave Applications.- Solder Free Interconnects for High Density Phased Array Integration.- Silicon Based On-Wafer and Discrete Packaging.- Patch-MMIC-Ferrite Integration in Novel Phased Array Technology.- Novel Antennas and Device Technology.- Broadbanding Guide Lines of Strip-Element Microstrip Phased Arrays.- U-Slot Patch Wideband Microstrip Antenna.- Surface Wave Mode Reduction for Rectangular Microstrip Antennas on High-Index Materials.- Integrated Strip Gratings on Top of Microstrip Antennas and Arrays for Low and Ultra-Low Cross-Polar Radiation.- A New Type of Dual Band Microstrip Array Fed by a Purely TEM Feeding Network.- The Integrated Dielectric Slab Waveguide-Wedge Antenna.- Dual-Polarized Rectangular Dielectric Resonator Antenna.- SiGe MMIC’s — on the Current State-of-the-Art.- FM Noise and Synchronization Behavior of a SIMMWIC 76.5 GHz Front-End.- Experimental and Numerical Results on High-FrequencyNoise of Si/SiGe HBTs.- The Development of Si and SiGe Technologies for Microwave and Millimeter-Wave Integrated Circuits.- 94 Ghz Schottky Detector with CMOS Preamplifier.- Semiconductor Waveguide Components for Analog Fiber-Optic Links.- Microwave Photonic Links with Very Low (? 3 dB) Amplifierless Noise Figure.- Polymer Optical Waveguides for Multi-Chip Modules.- Low-Voltage MMIC HBT VCO for Millimeter-Wave Communication Systems.- A Triple-Gate MESFET Voltage Variable Attenuator for Miilimeter-Wave Applications.- Modeling and CAD.- Types of Leaky Dominant Modes and Spectral Gaps on Printed-Circuit Lines.- 2-D Integral Spectral Domain Analysis of Leaky Modes in Covered and Uncovered Microstrip Lines.- Excitation of Leaky Modes on Printed Circuit Structures by Practical Feeds: An Investigation of Physical Meaning.- Complex Characteristic Impedance of a Leaky Conductor-Backed Slotline: Alternate Analysis Methods.- Suppression of Leakage on Printed Transmission Lines Using Finite-Width Dielectric Loading.- Electromagnetic Simulation of High-Speed and RF Multi-Chip Modules — An Overview.- Microstrip Antenna Analysis Using a Suite of Modeling Techniques-A Review.- A New Approach to the Design of Microwave Amplifiers.- Broadband Characterization of Representative Circuit-To-Circuit Interconnections.- Speculations on the Next Ten Years in Electromagnetic Field Simulation.- Ann and Knowledge-Based Approaches for Microwave Design.- CAD Needs for Flip Chip Coplanar Waveguide Monolithic Microwave Integrated Circuit Technology.- Computer Aided Design Tools for Microstrip Circuitries — An Application to Microstrip Patch Antennas of Circular Geometry.- Matching and Compensation Network Synthesis for MMICs.










Altre Informazioni

ISBN:

9780306457692

Condizione: Nuovo
Dimensioni: 254 x 178 mm
Formato: Copertina rigida
Illustration Notes:XI, 415 p.
Pagine Arabe: 415
Pagine Romane: xi


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